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WebFor high topo wafers the flat backside can be measured with the bottom sensor for improved repeatability. Chuck design is usually 3 resting pins near the wafer edge. As a unique feature, the SemDex Metrology System can be equipped with an additional StraDex t instrument to also measure the thin film thickness to give the most accurate stress value. Assessing wafers or thin films on wafers (e.g. SiO 2, GaAs, SiGe, etc.) before and after processing; Investigating processing effects (e.g. plasma treatment) on biomedical devices such as contact lenses, catheters and coated stents; Examining the impact of surface roughness on adhesion; Assessing trench shape/cleanliness on processed/patterned ... WebJan 1, 1994 · The comparison between contour lines measured for different support width (from point size up to 10x10 mm2 width) shows that the spreading of the full width half maximum (FHWM) will be 15 mm for minimum. 60 mm Fig. 3 Topographic wafer profile created by a 25 [Lm. high artificial spacer The measurement results and the table in Fig. 4 … the top kings crossword